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The growth of power semiconductor packaging technology is, to some extent, fueled by breakthroughs in material engineering and production techniques., The industry has pioneered an all-copper processing approach, so as to boost their power cycling endurance and long-term operational stability and alleviate the thermal expansion coefficient mismatch among diverse materials in modules. This methodology fundamentally consists of three key elements: ultrasonic welding of module copper power terminals, copper wire bonding interconnection and chip copper metallization…

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